SAN JOSE, Calif. &#151 The Defense Advanced Research Projects Agency (DARPA) has selected design software house PTC as the prime contractor for a research project to deliver three-dimensional (3D) ...

Together with partners, the SCHMID Advanced Integrated Circuit (IC) Packaging Lab Solution is currently the sole supplier for full TGV lab with all process steps necessary to turn a bare glass ...

A 1980s-era semiconductor fab in Austin, Texas, is getting a makeover. The Texas Institute for Electronics (TIE), as it’s ...

Flexible three-dimensional integrated circuits (3D ICs) enable high-density interconnects, miniaturization, and multifunctionality. Unlike rigid circuits, flexible 3D ICs can conform to various ...

PITTSBURGH, April 23, 2025 /PRNewswire/ -- Through continued collaboration with TSMC, Ansys (NASDAQ: ANSS) today announced enhanced AI-assisted workflows for radio frequency (RF) design migration and ...

Osaka, Japan – Scientists from the Flexible 3D-System Integration Laboratory at Osaka University developed a new method for the direct three-dimensional bonding of copper electrodes using silver, ...

3D-MID technology integrates electronic and mechanical functions into a single three-dimensional structure. Unlike traditional printed circuit boards (PCBs), which are flat, 3D-Circuits (3D-MID) ...

ST. PAUL, Minn.--(BUSINESS WIRE)--3M, a leading supplier of advanced materials to the semiconductor packaging industry, today announced the opening of the company’s application laboratory in Yangmei, ...

Collaboration will offer affordable detection and 3D perception systems with exclusivity in India, South Korea, and other developing markets Ness Ziona, Israel, Nov. 10, 2025 (GLOBE NEWSWIRE) -- ...

Apple is continuing work on advanced haptic feedback technologies, with the latest development outlined in a patent application describing methods of dynamically attracting or repelling a cover glass ...