TL;DR: Apple's iPhone 18 will feature the next-gen A20 chip using TSMC's advanced WMCM packaging with MUF technology, enhancing efficiency and yield. Eternal secured a major contract as a packaging ...

TL;DR: Apple is collaborating with TSMC to adopt advanced WMCM and SoIC packaging technologies for its next-generation A20 and server chips in 2026. These innovations enable ultra-dense chip stacking, ...

The promise of advanced packaging is being able to integrate heterogeneous chips, but a lot of work is needed to make that happen. Packaging is emerging as one of the most critical elements in ...

The iPhone 18 series could see a staggered market debut, with the budget-friendly models landing early in the year while the ...

The A20 chip widely expected to debut in the iPhone 18 Pro and folding iPhone will take advantage of a new packaging technique, on TSMC's 2nm chip fabrication technology. Rumors about the iPhone 18 ...

As Moore's Law slows, advanced packaging has become the critical lever driving breakthroughs in AI chip performance, according to DIGITIMES chief semiconductor analyst Tony Huang. Speaking with , ...

What does it take to put a smartphone in readiness for an AI-saturated world? For Apple’s future iPhone 18, the solution resides deep within the silicon in a processor that fuses the smallest ...

Apple this month refreshed the 14-inch MacBook Pro base model with its new M5 chip, and higher-end 14-inch and 16-inch ...

Automotive radar systems are typically composed of an antenna, front-end radar sensor and back-end signal processor. Current state-of-the-art automotive radar systems make use of the latest integrated ...