Applied Materials’ new Endura® Copper Barrier Seed IMS™ combines seven different process technologies in one system under high vacuum to improve chip performance and power consumption. An animation of ...
Here’s another entry in the 7400 Logic contest. [Circuitchef] used gates and a few flip-flops to build a two-player electronic Tic-Tac-Toe game. The full details or shared in the PDF file he links to ...
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