The MSB1054 multi-receiver module requires no external components and has built-in Flash memory, meeting needs of smartwatches, fitness trackers, logistics and ...

Sunnyvale, Calif. — Fujitsu Components America, Inc., released the industry's first copper XENPAK module (xMGC) that conforms to the new 10GBASE-CX4 specification (IEEE 802.03ak/D4.2) for low-cost ...

L&T Semiconductor Technologies Ltd (LTSCT), a wholly-owned subsidiary of Larsen & Toubro, has acquired the Power Module Design Assets of Fujitsu General Electronics Ltd (FGEL) of Japan. The strategic ...

Fujitsu is putting a Bluetooth 4.2 module based on a Nordic core into production. The module has an integrated antenna and fits into a 15.7 x 9.8 x 1.7 mm package. According to the company, the module ...

Transphorm Inc., Transphorm Japan Inc., and Fujitsu Semiconductor Limited announced today that Fujitsu Semiconductor group's CMOS-compatible, 150 mm wafer fab in Aizu-Wakamatsu, Fukushima, Japan, has ...

Fujitsu has launched a data center server which holds eight nodes - four installed in the front, and four in the back. The hardware is currently available in Japan, but will eventually be sold ...

The new Videon encoder module will be released during this year's International Broadcasting Convention (IBC), scheduled for September 11-15 in Amsterdam. The module incorporates Fujitsu's high ...

Fujitsu Microelectronics Europe (FME) and Fujitsu Microelectronics America Inc. (FMA) have licensed the FlexRay Communication Controller IP module from Robert Bosch GmbH for use in Fujitsu ...

Fujitsu Semiconductor Europe has announced a 65Gsample/s CMOS analogue-to-digital converter (ADC) for 100Gbit/s optical fibre communciations systems based on coherent detection. Implemented in a ...

Jan. 7, 2021 — Palantir Technologies Inc. (NYSE:PLTR) announced it was expanding its work with Fujitsu with a one-year, $8,000,000 contract between Fujitsu and Palantir Technologies Japan K.K. Fujitsu ...

specialized in devices for mobile phone equipment, has developed the T0311QZ1950 (Band I), T0311QZ0836 (Band V), and T0312QZ1880 (Band II) -- compact, high-performance transmitter modules with the ...