Also announce tool certification for TSMC N3C process and initial collaboration on TSMC’s newest A14 technology SAN JOSE, Calif.--(BUSINESS WIRE)-- Cadence (Nasdaq: CDNS) today announced it is ...

The growing adoption of 2.5D and 3D integrated circuits (3D-ICs) marks a major inflection point in the world of semiconductor design. Electronic designers demand greater integration densities and ...

A new technical paper titled “DeepOHeat: Operator Learning-based Ultra-fast Thermal Simulation in 3D-IC Design” was published (preprint) by researchers at UCSB and Cadence. “Thermal issue is a major ...

Cadence is trying to automate more aspects of the chip design process with Integrity 3D-IC, a suite of software tools it says can help engineers develop faster, less power-hungry chips using 3D ...

HAIFA, Israel--(BUSINESS WIRE)--proteanTecs, a global leader of deep data analytics for advanced electronics, announced today that the company has joined the TSMC Open Innovation Platform® (OIP) ...

Leveraging years of stacked BSI sensor production, Tower’s wafer-scale 3D-IC technology unlocks integration of SiPho and EIC processes for ...

SAN JOSE, Calif.--(BUSINESS WIRE)--Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced the leading Cadence ® Integrity ™ 3D-IC platform has achieved certification for and met all reference ...

Check out Electronic Design's coverage of DesignCon 2024. The semiconductor industry is entering the age of the chiplet. Today, many of the world’s most advanced chips consist of several smaller ...

Speeding time to market, the Cadence 3D-IC reference flow, featuring the Integrity 3D-IC platform, has been certified for UMC’s chip stacking technologies. UMC’s hybrid bonding solutions support the ...

Also announce tool certification for TSMC N3C process and initial collaboration on TSMC’s newest A14 technology The Cadence Integrity ™ 3D-IC Platform now features enhanced support for improved ...