Nasdaq

Cadence and TSMC Advance AI and 3D-IC Chip Design with Certified Design Solutions for TSMC’s A16 and N2P Process Technologies

Also announce tool certification for TSMC N3C process and initial collaboration on TSMC’s newest A14 technology SAN JOSE, Calif.--(BUSINESS WIRE)-- Cadence (Nasdaq: CDNS) today announced it is ...
Semiconductor Engineering

3D-IC: Great Opportunities, Great Challenges

The growing adoption of 2.5D and 3D integrated circuits (3D-ICs) marks a major inflection point in the world of semiconductor design. Electronic designers demand greater integration densities and ...
Semiconductor Engineering

3D-IC: Operator Learning Framework For Ultra-Fast 3D Chip Thermal Prediction Under Multiple Chip Design Configurations

A new technical paper titled “DeepOHeat: Operator Learning-based Ultra-fast Thermal Simulation in 3D-IC Design” was published (preprint) by researchers at UCSB and Cadence. “Thermal issue is a major ...
Electronic Design

Cadence Helps Add Another Dimension to Chip Designs with 3D Tools

Cadence is trying to automate more aspects of the chip design process with Integrity 3D-IC, a suite of software tools it says can help engineers develop faster, less power-hungry chips using 3D ...
Nasdaq

Ansys 3D-IC Power Integrity and Thermal Solutions Certified for TSMC 3Dblox Reference Flow

Ansys® Redhawk-SC™ and Ansys® Redhawk-SC Electrothermal™ multiphysics power integrity and 3D-IC thermal integrity platforms are certified as compliant with TSMC's 3Dblox standard for 3D-IC design ...
Business Wire

Cadence Integrity 3D-IC Platform Certified for TSMC 3DFabric Offerings

SAN JOSE, Calif.--(BUSINESS WIRE)--Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced the leading Cadence ® Integrity ™ 3D-IC platform has achieved certification for and met all reference ...

Nearfield Instruments Signs Multi-Year Development Project to Advance Semiconductor Metrology

Based in Rotterdam, Netherlands, Nearfield Instruments specializes in advanced metrology and inspection solutions for the semiconductor industry. The company develops and commercializes ...
Electronic Design

Design the Heat Out of 3D Chip Technology

Check out Electronic Design's coverage of DesignCon 2024. The semiconductor industry is entering the age of the chiplet. Today, many of the world’s most advanced chips consist of several smaller ...
Business Wire

proteanTecs Joins TSMC 3DFabric™ Alliance, Expanding Its Support of the 3D IC Ecosystem

HAIFA, Israel--(BUSINESS WIRE)--proteanTecs, a global leader of deep data analytics for advanced electronics, announced today that the company has joined the TSMC Open Innovation Platform® (OIP) ...
EDN

UMC certifies Cadence 3D-IC reference flow

Speeding time to market, the Cadence 3D-IC reference flow, featuring the Integrity 3D-IC platform, has been certified for UMC’s chip stacking technologies. UMC’s hybrid bonding solutions support the ...
EDN

Thermal analysis tool aims to reinvigorate 3D-IC design

The mainstream adoption of 3D-IC has become a question mark due to critical challenges ranging from early-stage chip designs to 3D assembly exploration to final design signoff. A new EDA tool claims ...